On May 29, 2025, Aoshikang Technology General Manager Mr. He Zixiu was invited to attend ZTE's 2025 Chuangxing Day ESG Forum held in Shenzhen. Cen...Read More

U.S. Representative Blake Moore (R-UT) on May 23 introduced the Protecting Circuit Boards and Substrates Act, bipartisan legislation that would author...Read More

IPC announced the April 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program on May 27. The book-to-bill ratio stands...Read More

South Korean media reported that a fire broke out at a printed circuit board (PCB) manufacturing plant in Yanggam-myeon, Hwaseong, at approximately 2:...Read More

Samsung Electronics plans to adopt glass substrate-based advanced semiconductor packaging technology by 2028, marking a major strategic shift aimed at...Read More

On May 22, 2025, Nippon Electric Glass (NEG) announced the development of large Through-Glass Via (TGV) glass core substrates compatible with next-gen...Read More

On May 22, STARTEAM GLOBAL announced it has been honored by Pilz, a global leader in automation technology, as the "Best PCB Supplier of 202...Read More

JNTC announced on May 22 that it has completed South Korea's first dedicated semiconductor glass substrate plant, capable of producing up to 10,00...Read More

A fire broke out at Sumitomo Electric Industries, Ltd.'s Osaka factory on the evening of May 20, prompting a large-scale emergency response. The i...Read More

MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of foundational technology solutions, announced a series of strategic developments underscorin...Read More