On July 10, Tongyu Advanced Materials (Guangdong) Co., Ltd. ("Tongyu Advanced Materials"), a leading Chinese supplier of electronic resins for copper-clad laminates (CCLs), made its debut on the Shenzhen Stock Exchange, trading under the ticker symbol 301630.

The company issued 10 million new shares in its IPO at a price of RMB 84 per share, bringing its total share capital to 40 million shares. No existing shares were offered in the listing.

Shares opened at RMB 180, a 114.29% increase from the offer price. By 10:07 a.m., the stock was trading at RMB 228, up 171.43%, giving the company a market capitalization of approximately RMB 9.12 billion (USD 1.27 billion).

The listing ceremony featured speeches from key leaders and guests, including:

Ms. Wu Jun, Deputy Party Secretary and Mayor of Sihui City

Mr. Zhang Chi, Chairman and General Manager of Tongyu Advanced Materials

Mr. Kong Xiangjie, Vice President of Industrial Securities Co., Ltd.

The event proceeded with the signing of the listing agreement, a traditional bell-ringing ceremony, and a commemorative group photo.

About Tongyu Advanced Materials:

Founded in December 2015 and based in Sihui, Zhaoqing City, Guangdong Province, Tongyu Advanced Materials specializes in the research, production, and sales of electronic resins used in copper-clad laminates (CCL). The company is a leading domestic supplier of high-end electronic resins and plays a key role in the supply chain of China’s CCL industry.

Tongyu serves major CCL manufacturers such as Kingboard, Shengyi Technology, Nanya New Materials, Wazam New Materials, Shennan Circuits, and Kinpo Electronics. Its resins are ultimately used in computers, consumer electronics, automotive electronics, and telecommunications equipment.

Committed to innovation and continuous improvement, Tongyu has built long-term partnerships with downstream customers by delivering cost-effective and reliable products.