Korean laser-processing specialist Laser Apps has successfully fabricated ultra-fine through-glass vias (TGVs) with high circularity on semiconductor glass substrates, a milestone expected to improve mechanical strength and manufacturability for advanced packaging and co-packaged...

The European semiconductor leader STMicroelectronics has delivered more than 5 billion chips to SpaceX's Starlink network over the past decade, with shipments potentially doubling by 2027 as demand accelerates. The milestone comes as ST secures a €1 billion credit line from the E...