The University of Tokyo announced on May 31, 2025, that its research team has developed a high-precision laser drilling technique for glass substrates...Read More

As cloud service providers (CSPs) ramp up efforts to develop their own custom chips (ASICs), ASICs are emerging as a key architecture alongside GPUs i...Read More

LX Semicon is accelerating its shift away from display driver ICs (DDIs), which currently make up over 90% of its revenue, by expanding into automotiv...Read More

Samsung Electro-Mechanics (KRX: 009150) is accelerating its entry into the next-generation glass substrate business, with plans to ship prot...Read More

On May 29, 2025, Aoshikang Technology General Manager Mr. He Zixiu was invited to attend ZTE's 2025 Chuangxing Day ESG Forum held in Shenzhen. Cen...Read More

U.S. Representative Blake Moore (R-UT) on May 23 introduced the Protecting Circuit Boards and Substrates Act, bipartisan legislation that would author...Read More

IPC announced the April 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program on May 27. The book-to-bill ratio stands...Read More

South Korean media reported that a fire broke out at a printed circuit board (PCB) manufacturing plant in Yanggam-myeon, Hwaseong, at approximately 2:...Read More

Samsung Electronics plans to adopt glass substrate-based advanced semiconductor packaging technology by 2028, marking a major strategic shift aimed at...Read More

On May 22, 2025, Nippon Electric Glass (NEG) announced the development of large Through-Glass Via (TGV) glass core substrates compatible with next-gen...Read More