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U.S. Launches $3B PCB Bill as Taiwan, IPC Deepen Cross-Border Collaboration

U.S. Representative Blake Moore (R-UT) on May 23 introduced the Protecting Circuit Boards and Substrates Act, bipartisan legislation that would authorize $3 billion (approximately 21.6 billion yuan) to strengthen domestic manufacturing and R&D of printed circuit boards (PCBs). The bill aims to reduce reliance on foreign supply chains, enhance national security, and bolster U.S. economic competitiveness in the microelectronics sector.

“While we've made real progress in domestic chip production, microchips can't function without printed circuit boards—90 percent of which are made in Asia, including half in the People's Republic of China,” said Rep. Raja Krishnamoorthi (D-IL), a co-sponsor of the bill. “Our bipartisan bill reduces that dangerous dependence by rebuilding U.S. manufacturing, strengthening supply chains, and supporting American workers.”

The proposed legislation would provide a 25% tax credit for the purchase of American-made PCBs and create a CHIPS-style financial assistance program for U.S.-based PCB manufacturers and research facilities. For awards exceeding $150 million, a presidential determination would be required, and clawback provisions are included to ensure accountability in the use of funds.

“This bill provides a tried-and-true approach to incentivizing American companies to produce printed circuit boards here at home,” said Rep. Moore. “It will maintain the integrity of military and national security materials, boost our economy and workforce, and usher in a new era of American manufacturing.”

The legislation is backed by IPC International, Summit Interconnect, and the Printed Circuit Board Association of America, and has been referred to the House committees on Ways and Means; Energy and Commerce; and Science, Space, and Technology.

The U.S. initiative comes as international collaboration in the PCB sector gains momentum. On May 16, Taiwan Printed Circuit Association (TPCA) hosted a high-level industry luncheon in Taipei with the IPC Board of Directors, marking the first IPC board meeting held in Taiwan. During the event, TPCA Chairman Albert Chang and IPC President Dr. John W. Mitchell signed a memorandum of understanding to deepen bilateral cooperation in training, exhibitions, and industry development.

TPCA said the agreement signals a new chapter of collaboration between the U.S. and Taiwanese electronics industries. The two organizations will co-host exhibitions and forums at the TPCA Show this October in Taiwan, and TPCA is also planning to lead a Taiwan Pavilion at the IPC APEX EXPO—North America's premier PCB and electronics assembly trade show—in March 2026.

By strengthening policy support at home and international industry ties abroad, the U.S. is moving to secure its role in the evolving global electronics supply chain.

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