U.S.-based glass materials giant Corning is developing a new type of glass specifically designed for semiconductor substrates, signaling its aggressive entry into the emerging market for next-generation glass substrates. The move sets the stage for heightened competition with rivals such as Germany's Schott and Japan's Asahi Glass.

According to industry sources, Corning is working on advanced glass tailored for semiconductor packaging applications and is currently conducting evaluations with both domestic and international customers. The company is supplying prototypes—mainly to glass processing equipment makers—as it accelerates preparations to capture market share.

The prototype, known as “SG 3.3 Plus,” reportedly features major improvements in coefficient of thermal expansion (CTE) and elastic modulus—two key factors that determine a glass substrate's suitability for semiconductor use. CTE affects how well the material integrates with coatings and adhesives, while the elastic modulus relates to how much the material deforms under stress.

A representative from a Korean glass processing company noted that the new Corning material is better suited for semiconductor glass substrates than its previous offerings, and is expected to enhance the performance of final products.

Glass substrates are thinner and more dimensionally stable than conventional plastic-based PCBs, allowing for finer circuit patterning. As a result, they are gaining attention as a critical enabling technology for next-generation semiconductors used in AI and high-performance computing (HPC). Major players like Samsung, Intel, TSMC, AMD, and Broadcom are exploring adoption, although technical challenges—particularly in materials—remain a significant hurdle.

One key issue has been “seware”—glass breakage or peeling during processing—which hampers yield and product reliability. Corning's new material aims to address such defects by improving glass properties and process compatibility.

Corning's entry into this space is expected to intensify the battle for leadership in the glass substrate materials market. Until now, Schott has been the dominant supplier for glass substrate prototyping, thanks to its diverse product portfolio and proven material performance.

However, the competitive landscape may be shifting. “While Schott glass has long been preferred in the semiconductor substrate field, Corning's new dedicated material is changing the dynamic,” said one industry insider. “Many processing companies are now exploring partnerships with Corning and planning to adopt its new product.”

One glass processor added, “With our new automated production lines at our expanded Incheon facility, we expect to significantly improve output. Backed by customer trust, we aim to drive continuous growth through next-generation PCB technology.”