Hana technology, a South Korea-based advanced manufacturing equipment company, announced on July 7 that it has successfully developed its own Through Glass Via (TGV) processing technology—a core step in semiconductor glass substrate manufacturing.

The company unveiled its in-house solution at a technical demonstration, revealing a complete proprietary system that spans from raw glass wafer processing to TGV drilling and post-processing. This positions Hana technology to actively enter the emerging glass substrate market for next-generation semiconductors.

Glass substrates are gaining attention for their superior flatness, fine-line capability, thermal stability, and integration density compared to conventional organic substrates or silicon interposers. These properties make them ideal for advanced applications in AI semiconductors, high-performance computing (HPC), and 5G communications.

To enable chip-to-chip connectivity in glass substrates, precise drilling of micron-scale vertical interconnects—TGVs—is essential. Hana technology stated that earlier solutions often failed to meet customer demands for diameter consistency, taper ratio, and surface smoothness. By integrating proprietary optical design, laser fusion technology, and thermal deburring techniques, Hana technology has overcome these challenges.

Currently, the company is capable of drilling 80μm holes in 1.1mm-thick glass substrates, meeting stringent customer quality standards. It has also resolved critical issues such as post-processing cracks by optimizing the match between laser drilling and chemical etching processes.

Hana technology is now conducting process evaluations with major domestic wafer and packaging companies and has entered equipment introduction discussions with several clients. The firm also revealed that it has signed NDAs with major U.S.-based IT and semiconductor companies to explore global adoption of its TGV solution. Initial equipment shipments are expected in the first half of 2026.

A Hana technology spokesperson noted, “The TGV equipment market is forecast to grow at a CAGR of 34% through the early 2030s, driven by surging demand in AI, 5G, and high-performance semiconductor sectors. This breakthrough marks a new growth engine for Hana technology, following our success in battery manufacturing equipment.”