JNTC announced on May 22 that it has completed South Korea's first dedicated semiconductor glass substrate plant, capable of producing up to 10,000 units per month.
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Taiwan-based Hon Hai Precision Industry Co., also known as Foxconn, has announced plans to invest in France's first advanced semiconductor packaging and testing facility using fan-out wafer-level packaging (FOWLP) technology.
Over 3,000 PCB Companies listed.
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