A worker was killed in a construction accident at Taiwan Semiconductor Manufacturing Co. (TSMC)'s advanced chip-on-wafer-on-substrate (CoWoS) pack...Read More

Samsung Electronics plans to adopt glass substrate-based advanced semiconductor packaging technology by 2028, marking a major strategic shift aimed at...Read More

Four leading American semiconductor companies—Intel, Qualcomm, Micron, and Texas Instruments—have jointly submitted formal comments urging the Trump a...Read More

Nvidia is preparing to release a new artificial intelligence chip for the Chinese market as early as June, offering a significantly lower-cost alterna...Read More

Deposition Technology Inc., a U.S. subsidiary of Korean semiconductor materials firm WONIK QnC, is investing $100 million to expand its manufacturing ...Read More

Russia's official imports of Intel and AMD processors fell sharply in 2024, with government customs data showing a 95% drop in Intel CPU shipments...Read More

On May 22, 2025, the U.S. Federal Communications Commission (FCC) unanimously approved new rules barring Chinese laboratories deemed national security...Read More

On May 22, 2025, Nippon Electric Glass (NEG) announced the development of large Through-Glass Via (TGV) glass core substrates compatible with next-gen...Read More

Shares of Navitas Semiconductor more than doubled on Thursday, May 21, after the company was named a partner in Nvidia's next-generation data cent...Read More

On May 22, STARTEAM GLOBAL announced it has been honored by Pilz, a global leader in automation technology, as the "Best PCB Supplier of 202...Read More