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Taesung Shares Surge on New Copper Foil Deal, Expands Equipment Supply to Chinese Substrate Makers

On November 7, 2025, South Korean PCB and semiconductor equipment maker Taesung Co., Ltd. (KOSDAQ: 323280) saw its share price jump more than 12% in morning trading after announcing a new supply contract with a major Korean conglomerate.

Under the agreement, Taesung will provide composite copper foil materials coated with copper using its self-developed electroplating equipment on pretreated films supplied by the conglomerate. Industry sources said the conglomerate's end customer, a leading company in copper foil processing equipment, has approved Taesung as a qualified supplier, marking a significant step for the company's expansion in Korea's glass and composite copper foil value chains.

Just days earlier, on October 28, Taesung announced another major win — a KRW 5.8 billion (Approximately USD 4.06 million or CNY 29 million) contract to supply etching equipment to a Chinese semiconductor substrate manufacturer. The deal includes deliveries to two subsidiary factories, one worth KRW 5.1 billion and another approximately KRW 700 million.

Despite lingering challenges in the substrate market due to post-pandemic inventory oversupply, Taesung said the order reflects its technological credibility and long-term partnerships with key Chinese clients. The company's proprietary precision etching systems, applicable to both high-density semiconductor substrates and glass substrates, help improve manufacturing efficiency and product quality—critical as AI server components become increasingly complex.

Taesung has also begun supplying equipment to major domestic PCB manufacturers, positioning itself as a core supplier in AI PCB and glass substrate production. Its technology now spans AI, PCB, glass substrate, and composite copper foil process equipment, earning strong recognition for innovation and product reliability.

A Taesung official noted that the company's differentiated etching capabilities and stable quality are gaining recognition overseas. With semiconductor investment in China expected to grow in 2026, additional orders are anticipated.

The company added that it entered the glass substrate value chain earlier this year and is expanding collaborations with both domestic and international corporations. As several customers have accelerated their mass-production schedules, equipment shipments and installations are expected to ramp up before year-end, with tangible results likely emerging from the fourth quarter onward.

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