On July 17, 2025, Tata Electronics and Robert Bosch GmbH signed a Memorandum of Understanding (MoU) to strengthen cooperation in semiconductor chip pa...Read More

On July 20, a 50-ton trailer overturned during construction at TSMC's new CoWoS advanced packaging facility in Taiwan's Chiayi Science Park, m...Read More

On July 17, 2025, Finland-based PCB manufacturer Aspocomp appointed Terhi Launis as its new Chief Financial Officer (CFO), effective September 1. Laun...Read More

Fujifilm has announced the successful development of a next-generation photoresist designed for semiconductor manufacturing that contains no per- and ...Read More

On July 9, South Korea-based Shinhyup Electronics Co., Ltd. announced a major investment of KRW 70 billion (approximately USD 50 million or CNY 361 mi...Read More

On July 18, Japan's Rapidus announced it has begun prototyping 2nm gate-all-around (GAA) transistor test wafers at its IIM-1 fab in Chitose, Hokka...Read More

On July 18, South Korea's Hoimyung Corporation signed a KRW 67.3 billion (approximately USD 48.4 million or CNY 350 million) investment memorandum...Read More

Wenru Li, who recently resigned as Vice President of Materials Management at TSMC, is reportedly being considered to head NVIDIA's Taiwan operatio...Read More

On July 17, 2025, Japanese deep-tech startup Elephantech announced the launch of a groundbreaking 15 nm-class copper nanofiller—the smallest commercia...Read More

On July 16, Michigan Governor Gretchen Whitmer confirmed that Sandisk has scrapped plans to build a massive semiconductor manufacturing facility in Mu...Read More