On August 1, Chinese semiconductor packaging leader HT-Tech announced it will invest RMB 2 billion (approximately $277 million) to establish a new who...Read More

On July 30, a former engineer who worked for four years at TSMC's Arizona fab posted a detailed complaint on Reddit, alleging chaotic training in ...Read More

Samsung Electro-Mechanics (SEMCO) has recruited Gang Duan, a veteran semiconductor packaging engineer formerly with Intel, as Vice President of its U....Read More

Intel has announced the upcoming retirement of three corporate vice presidents from its Intel Foundry division, marking a significant leadership shift...Read More

On July 30, Japan-based Inspec announced the launch of two next-generation systems targeting advanced semiconductor package substrates: the SX7000 ser...Read More

On August 1, NVIDIA updated its list of partners for its next-generation 800V high-voltage direct current (HVDC) power architecture, naming Chinese Ga...Read More

The European Commission has finalized three new regulatory frameworks under its sustainable electronics strategy, signaling a major shift for the PCB ...Read More

On July 30, 2025, the Shanghai Pudong New Area People's Court sentenced Zhang Kun, founder and CEO of Chinese chip startup Zunpai Communication Te...Read More

On July 31, China's Cyberspace Administration (CAC) summoned U.S. chip giant NVIDIA for a regulatory meeting, citing serious cybersecurity concern...Read More

SKC (KRX: 011790) reported consolidated revenue of KRW 467.3 billion and an operating loss of KRW 70.2 billion (approximately USD 50 million or CNY 36...Read More