South Korean media reported that a fire broke out at a printed circuit board (PCB) manufacturing plant in Yanggam-myeon, Hwaseong, at approximately 2:...Read More

Samsung Electronics plans to adopt glass substrate-based advanced semiconductor packaging technology by 2028, marking a major strategic shift aimed at...Read More

On May 22, 2025, Nippon Electric Glass (NEG) announced the development of large Through-Glass Via (TGV) glass core substrates compatible with next-gen...Read More

On May 22, STARTEAM GLOBAL announced it has been honored by Pilz, a global leader in automation technology, as the "Best PCB Supplier of 202...Read More

JNTC announced on May 22 that it has completed South Korea's first dedicated semiconductor glass substrate plant, capable of producing up to 10,00...Read More

A fire broke out at Sumitomo Electric Industries, Ltd.'s Osaka factory on the evening of May 20, prompting a large-scale emergency response. The i...Read More

MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of foundational technology solutions, announced a series of strategic developments underscorin...Read More

South Korean semiconductor inspection and repair equipment specialist Gigavis (KOSDAQ: 420770) announced on May 19, 2025, that it has s...Read More

A leading global PCB manufacturer with a market cap of approximately $3 billion, TTM Technologies, Inc. (NASDAQ: TTMI), recently reported strong ...Read More

AP System has officially launched research and development efforts for glass substrate manufacturing equipment, a move that could position the company...Read More