South Korea's Chemtronics (KOSDAQ: 089010) announced progress in its semiconductor glass substrate technology, claiming to have resolved brittleness issues that previously led to cracks during through-glass via (TGV) processing. The company expects to complete its pilot line by the end of October and is targeting mass production by late 2027.

According to company officials, Chemtronics has improved yields by using specially engineered strengthened glass that withstands hydrofluoric acid etching, a critical step following laser drilling. This has enabled the company to achieve processing yields above 50%. However, plating remains the major challenge before commercialization.

Glass substrates require a two-step plating process—seed plating and full-fill electroplating—to form conductive pathways inside the vias. Uneven current density during electroplating can cause irregular thickness, shorts between vias, or voids that increase resistance and signal loss. Chemtronics aims to achieve a via aspect ratio of up to 20:1, but acknowledged that plating yield, process speed, and cost remain significant barriers. The company is also exploring alternative methods such as inkjet-based plating to simplify post-processing and improve productivity.

In parallel, Chemtronics is seeking external investment to support its entry into the high-barrier but high-potential glass substrate market. The company is in discussions with private equity and venture capital firms, though its relatively weak profitability, high debt ratio, and low shareholder equity stake of around 25% raise governance and financing concerns.

Industry observers note that while glass substrates are drawing strong interest as next-generation packaging solutions for advanced semiconductors, Chemtronics must secure both technological breakthroughs in plating and financial backing to remain competitive.