On May 22, 2025, Nippon Electric Glass (NEG) announced the development of large Through-Glass Via (TGV) glass core substrates compatible with next-generation semiconductor packaging.
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On May 22, 2025, the U.S. Federal Communications Commission (FCC) unanimously approved new rules barring Chinese laboratories deemed national security risks from participating in the testing and certification of electronic devices sold in the U.S.
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