On May 22, 2025, the U.S. Federal Communications Commission (FCC) unanimously approved new rules barring Chinese laboratories deemed national security...Read More

On May 22, 2025, Nippon Electric Glass (NEG) announced the development of large Through-Glass Via (TGV) glass core substrates compatible with next-gen...Read More

Shares of Navitas Semiconductor more than doubled on Thursday, May 21, after the company was named a partner in Nvidia's next-generation data cent...Read More

On May 22, STARTEAM GLOBAL announced it has been honored by Pilz, a global leader in automation technology, as the "Best PCB Supplier of 202...Read More

On the evening of May 22, Beijing Time, Xiaomi officially launched China's first 3nm smartphone chip—the "XRING O1"—at its "New Sta...Read More

Taiwan-based Hon Hai Precision Industry Co., also known as Foxconn, has announced plans to invest in France's first advanced semiconductor packagi...Read More

Ukrainian drones struck a key Russian semiconductor facility overnight, damaging the Bolkhovsky Semiconductor Devices Plant in Oryol Oblast, about 200...Read More

JNTC announced on May 22 that it has completed South Korea's first dedicated semiconductor glass substrate plant, capable of producing up to 10,00...Read More

Wolfspeed, the leading U.S. silicon carbide (SiC) chipmaker, is reportedly preparing to file for Chapter 11 bankruptcy protection in the coming weeks,...Read More

A fire broke out at Sumitomo Electric Industries, Ltd.'s Osaka factory on the evening of May 20, prompting a large-scale emergency response. The i...Read More