On January 17, Taiwan's leading semiconductor manufacturer, TSMC, has reportedly plans to build two new CoWoS (Chip-on-Wafer-on-Substrate) facilit...Read More

On January 17, the U.S. Department of Commerce announced the allocation of $1.4 billion in funding through the CHIPS Act National Advanced Packaging M...Read More

On January 14, Merlin Circuit Technology, a subsidiary of the leading PCB manufacturer Merlin PCB Group, proudly announced that it has been awarded th...Read More

Due to oversupply, the global NAND flash memory market has seen a continuous price drop for the past four months, prompting major manufacturers to red...Read More

On December 16, 2024, the Printed Circuit Board Association of America (PCBAA) shared a significant update, revealing that its leadership, alongside I...Read More

Three power semiconductor plants across different regions have recently announced major updates, becoming a focal point of the industry: Infineon'...Read More

Innoscience, a leading Chinese GaN (gallium nitride) manufacturer, announced late on January 16 that it, along with its wholly-owned subsidiary Innosc...Read More

On January 15, 2025, Japan's Nippon Electric Glass Co., Ltd. (NEG) unveiled a new glass-ceramic core substrate, the "GC Core," designed ...Read More

Major technology companies are gearing up for another round of layoffs, with Meta, Microsoft, and Amazon leading the charge, according to multiple rep...Read More

The U.S. Department of Commerce's Bureau of Industry and Security (BIS) released new regulations late last night to strengthen export controls on ...Read More