On July 18, South Korea's Hoimyung Corporation signed a KRW 67.3 billion (approximately USD 48.4 million or CNY 350 million) investment memorandum...Read More

Wenru Li, who recently resigned as Vice President of Materials Management at TSMC, is reportedly being considered to head NVIDIA's Taiwan operatio...Read More

On July 17, 2025, Japanese deep-tech startup Elephantech announced the launch of a groundbreaking 15 nm-class copper nanofiller—the smallest commercia...Read More

On July 16, Michigan Governor Gretchen Whitmer confirmed that Sandisk has scrapped plans to build a massive semiconductor manufacturing facility in Mu...Read More

On July 15 (Beijing time), Wingtech Technology—a China-based electronics manufacturer known for its operations in ODM smartphones and semiconductor pa...Read More

On July 16, a serious workplace accident occurred at TSMC's AP7 advanced packaging facility in Chiayi, just 13 days after construction resumed fol...Read More

On July 16, 2025, Japan's Shinko Electric Industries announced that its Kohoku and Wakaho plants in Nagano City have received IATF 16949 certifica...Read More

On July 14, China’s State Administration for Market Regulation (SAMR) announced conditional approval for Synopsys’ proposed $35 billion acquisition of...Read More

On July 15, South Korea's Hoseo University signed a strategic partnership agreement with Simmtech Co., Ltd. (KOSDAQ:222800), a leading global...Read More

U.S. chip giant Broadcom has reportedly canceled plans to build a semiconductor packaging and testing plant in Spain, dealing a blow to the country...Read More