On August 5, Japanese optical technology leader Ushio Inc. has announced the upcoming launch of the UX-59113, a next-generation stepper designed for advanced semiconductor package substrates, including organic and glass panels. The new system achieves a resolution of L/S = 1.5 μm and enables stitchless exposure over fields larger than 100 mm x 100 mm, significantly improving yield and throughput in panel-level packaging (PLP).

Slated for commercial release in fiscal 2026, the UX-59113 addresses critical industry needs for finer line/space patterning and larger substrate sizes driven by growing demand for high-performance semiconductors used in data centers, chiplets, and AI accelerators.

Optimized for Panel-Level and Glass Substrate Applications

Traditional wafer steppers require multiple exposures with stitching for large substrates, introducing misalignment risks that lower yield and efficiency. Ushio's new platform enables single-shot exposure across large areas—eliminating stitching—while maintaining high precision, making it ideal for large organic and glass-based IC package substrates.

The UX-59113 also features a newly developed handling platform that compensates for warpage and surface undulation—key challenges in panel-level mass production.

Strengthening Exposure Leadership in Advanced Packaging

Ushio holds approximately 90% global market share in steppers for IC package substrates. With the addition of the UX-59113, the company is expanding its portfolio to meet growing needs for interposer substrates, glass-based packaging, and next-generation PLP technologies.

This product joins Ushio's comprehensive lineup, which includes traditional steppers, maskless direct imaging systems, and the newly added DLT exposure tool developed in partnership with Applied Materials in December 2023.

Company Statement

"Ushio is committed to advancing exposure technology for cutting-edge IC packaging," said the company. "By combining our proprietary optical systems with decades of expertise in substrate exposure, we are enabling the next generation of semiconductor packaging solutions."