On October 22, 2025, Tongtai Machine & Tool Co., Ltd. (TWSE: 4526) and Contrel Technology Co., Ltd. (TWSE: 8064) jointly showcased their next-generation electronic manufacturing equipment and integrated process solutions at the Taiwan Printed Circuit Association (TPCA) Show 2025. Centered on "lightweight, precision, and multi-axis machining," the collaboration highlights the two companies' complementary strengths in PCB, substrate, and glass substrate processing for advanced packaging applications.

Tongtai, a long-time leader in PCB drilling solutions, unveiled two new high-speed precision drilling machines — the TDL-635 and TCDM-620CL — designed to meet the growing demands of advanced substrate manufacturing. The TDL-635 features a lightweight platform and low-temperature high-speed spindle for high responsiveness and positioning accuracy, reducing setup time while maintaining hole precision. The TCDM-620CL, equipped with multi-axis independent control and CCD vision alignment, supports high-accuracy through-hole and back-drill processes. Its automatic compensation for board expansion and contraction ensures precise layer-to-layer alignment, making it ideal for 5G and IC substrate production.

Tongtai stated that the company will continue to focus on smart automation and multi-axis machining technologies to enhance stability and productivity, aligning with the rising demand driven by AI and advanced packaging.

Contrel, meanwhile, focused on laser processing and glass substrate technologies, unveiling its latest innovations in Through Glass Via (TGV) and Redistribution Layer (RDL) processes. Its newest TGV system offers a drilling speed of up to 10,000 vias per second with ±5 μm positioning accuracy, supporting multiple glass substrate sizes for applications including glass core substrates, FOPLP, and Micro LED packaging.

Contrel also introduced a comprehensive "Smart Process Solution," integrating laser drilling, PVD, and electroplating to establish a complete TGV ecosystem. The company emphasized that the integration of smart technologies enhances process automation, stability, and yield, forming a critical foundation for next-generation electronic and semiconductor manufacturing.

Contrel's partner, Fulin Technology, provides vacuum thin-film metallization (PVD) capabilities that seamlessly integrate with laser drilling. This allows for a fully connected process chain—from glass via formation and metallization to conductive layer creation—improving yield stability and mass production reliability.

Tongtai Group noted that the collaboration between Tongtai and Contrel demonstrates their complementary expertise in electronic and semiconductor equipment. It also marks a strategic step forward from traditional PCB manufacturing toward next-generation glass substrate technologies, reinforcing both companies' commitment to innovation, process integration, and sustainable growth in the evolving semiconductor ecosystem.