On July 17, 2025, Tata Electronics and Robert Bosch GmbH signed a Memorandum of Understanding (MoU) to strengthen cooperation in semiconductor chip packaging, manufacturing, and automotive electronics. The agreement marks a strategic step in India's ambitions to build a self-reliant electronics and semiconductor ecosystem.

The MoU was signed by Dr. Randhir Thakur, CEO and Managing Director of Tata Electronics, and Dirk Kress, Executive Vice President of Semiconductor Operations at Bosch. The companies will collaborate on advanced chip packaging at Tata's upcoming assembly and test facility in Jagiroad, Assam, and semiconductor wafer fabrication at its Gujarat foundry, which is being developed in partnership with Taiwan's Powerchip.

The ₹27,000 crore ($3.2 billion) Assam facility, expected to begin operations in mid-2025, will focus on advanced chip packaging with a capacity of up to 41 million chips per day. Meanwhile, the ₹91,000 crore ($10.9 billion) fab in Gujarat's Dholera region aims to produce 50,000 wafers per month starting in 2026.

In addition to semiconductor manufacturing, the MoU outlines joint exploration of electronic manufacturing services (EMS) for vehicle electronics—an increasingly vital area as vehicles become more software- and sensor-driven.

Dr. Thakur said the partnership would help build a reliable global supply chain and reinforce India's position as a growing force in electronics manufacturing. Bosch's Dirk Kress added that the collaboration reflects Bosch's commitment to supporting the evolution of automotive technology and strengthening local supply chains.

This partnership highlights several key developments in India's semiconductor strategy:

 ● Vertical integration across the value chain, from chip design and wafer fabrication to packaging and system implementation.

 ● Job creation, particularly in regions like Assam, where the semiconductor industry is expected to stimulate economic development.

 ● Strengthened global partnerships, with Tata and Bosch aligning to support advanced automotive electronics and 3D packaging technologies.

Looking ahead, Tata Electronics will continue ramping up its fabrication and packaging capacity, while Bosch is expected to contribute advanced packaging technologies such as 3D and system-in-package (SiP) solutions.

The alliance marks a significant milestone in India's semiconductor journey, blending domestic investment, global expertise, and government policy support to build a resilient, world-class chipmaking ecosystem.