The 26th Taiwan Printed Circuit Board International Exhibition (TPCA Show 2025) will take place from October 22 to 24 at Taipei Nangang Exhibition Center, Hall 1, alongside the International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT 2025), held from October 21 to 24.

This year's exhibition has reached a record scale, featuring more than 670 international exhibitors across 1,750 booths, highlighting Taiwan's growing influence in the global PCB supply chain amid the AI boom. Themed "Energy-Efficient AI: From Cloud to the Edge," the event showcases the increasingly close integration between the semiconductor and PCB industries as computing power demands surge.

The show will emphasize how AI applications are expanding from large data centers to edge devices, bringing new technical challenges and opportunities across PCB, substrate, and advanced packaging technologies. The focus areas include high-performance and energy-efficient solutions in PCB and SMT manufacturing, green energy technologies, thermal management, and smart manufacturing.

According to the Taiwan Printed Circuit Association (TPCA), the local PCB industry has maintained steady momentum, driven by demand from AI, high-performance computing (HPC), satellite communications, and automotive electronics. Despite challenges such as currency fluctuations and weaker consumer demand in mainland China, TPCA expects Taiwan's PCB output value to reach NT$915.7 billion in 2025, representing 12.1% annual growth, outpacing the previous two years.

Institutional investors are paying close attention to Zhen Ding Technology  (4958.TW), ITEQ Corporation (6213.TW), Co-Tech Development Corp (8358.TWO), Elite Material (EMC, 2383.TW), Unimicron (3037.TW), and Taiwan Union Technology (TUC, 6274.TWO) — leading PCB manufacturers expected to benefit from upgrades in high-frequency materials, copper foil technology, and next-generation IC substrates driven by AI and high-performance computing demand.

The exhibition's opening ceremony will be headlined by Unimicron Chairman Tzu-Chang Tseng, who will deliver a keynote titled "Opportunities and Challenges for the PCB Supply Chain Amid AI System Growth." The TPCA Leadership Summit later that day will feature industry leaders including Quanta Computer Vice President Chi-Ling Yang, TPCA Chairman Yuan-Ming Chang (also Chairman of Ya Hwa), TTM Group COO Ting-Chuan Lee, Taiwan Union Technology Chairman Ting-Yu Tung, and Prismark Partner Alex Jiang, who will discuss the global industry outlook toward 2026.

On the second day, the Semiconductor and PCB Heterogeneous Integration Forum will feature prominent figures such as Professor Chin-Tai Shih, SEMI Global Board Chairman Tien-Yu Wu, Zhen Ding Group Chairman Ching-Fong Shen, and General Manager Jen-Fu Chien, who will explore collaboration between the semiconductor and PCB sectors.

Additionally, a special seminar on October 24 will examine how Q-cloth materials impact PCB manufacturing processes, with speakers from Kinsus R&D, glass fiber and copper foil producers, and substrate material suppliers participating in in-depth technical exchanges.

With record attendance expected to exceed 70,000 visitors, TPCA Show 2025 underscores Taiwan's central role in the global PCB ecosystem and its vital contribution to enabling next-generation AI, packaging, and intelligent manufacturing technologies.