On November 10, Taiwan-based precision equipment maker Ta Liang Technology Co., Ltd. (3167.TW) reported record earnings for the first three quarters of 2025, driven by surging demand for semiconductor and high-end PCB production equipment. The company's shipments remained robust, keeping revenue at a high level, with after-tax earnings per share (EPS) reaching an all-time high for the period.

Ta Liang's product mix continues to be dominated by high-end PCB equipment — including drilling and routing machines — which account for roughly 90% of total revenue. Within this segment, advanced systems make up around half of sales. Its semiconductor equipment business, representing about 10% of revenue, covers CMP pad metrology, step-height measurement, and wafer edge inspection tools.

Notably, Ta Liang's inner-layer thickness measurement system has received certification from a leading U.S. GPU manufacturer, with industry sources saying the product shows strong market competitiveness.

According to analysts, Ta Liang currently holds orders exceeding NT$3 billion (approximately USD 96.6 million or CNY 687.6 million), providing visibility through 2026. Additional shipment momentum is expected from the company's new Nanjing facility, which will soon add production capacity.

On November 11, Group Up Industrial Co., Ltd. (6664.TWO), a leading PCB and substrate dry-process equipment provider, announced its third-quarter results for 2025, posting a net profit of NT$304 million (approximately USD 9.8 million or CNY 69.7 million) and EPS of NT$5.02 — the second-highest quarterly result in its history. Cumulative EPS for the first three quarters reached NT$10.74, equivalent to earnings of more than one full-year share value.

Analysts expect Group Up's revenue to achieve modest growth in 2025, with stable profitability, while operations in 2026 are projected to outperform this year thanks to higher contributions from advanced products. The company noted that demand for IC substrate and fan-out panel-level packaging (FOPLP) equipment remains strong, supported by the ongoing trend toward high-end PCB manufacturing and the growth of AI and high-performance computing (HPC) applications.

Group Up said it continues to collaborate closely with materials suppliers, equipment vendors, and key customers to develop new models, with shipments expected to begin in the first quarter of 2026.

The company's customer base spans Taiwan, mainland China, Japan, South Korea, Europe, the U.S., and Southeast Asia, covering major ABF substrate and flex-rigid PCB manufacturers, as well as leading semiconductor foundries. It has also secured orders from top European IDMs and major U.S. semiconductor companies.

Analysts believe that with continued overseas market expansion and the growing impact of its advanced packaging and high-end product strategies, Group Up is well-positioned for further operational growth in 2026.