On August 6, Taesung, a leading South Korean manufacturer of wet process equipment for PCBs and semiconductor substrates, held a shipment ceremony at its Ansan headquarters for the country's first domestically developed Through-Glass Via (TGV) alkaline etching equipment.

The event marked the official dispatch of the company's inaugural TGV etcher, featuring Taesung's proprietary precision wet etching technology based on alkaline chemistry. The system enables ultra-fine TGV processing with minimal taper angles, low sidewall roughness, and high dimensional accuracy—critical for high-density, high-aspect-ratio designs. These capabilities also improve compatibility and reliability in subsequent metallization and packaging steps.

Taesung CEO Jonghak Kim addressed employees at the ceremony, commending the development team's efforts and reaffirming the company's vision of becoming a top-tier global equipment provider.

Glass substrates are rapidly gaining traction as essential interposer and core materials in high-performance computing (HPC), AI chipsets, 5G/6G RF modules, and fan-out panel-level packaging (FOPLP). Taesung is currently the only company in Korea to develop wet process equipment covering the entire TGV manufacturing chain, positioning it for early leadership in this emerging market.

Prior to the etcher, Taesung had already supplied TGV cleaning systems to customers. It is now developing plating systems for mass production in the second half of 2025. By completing a full TGV process lineup—cleaning, etching, and plating—within the year, Taesung aims to offer customers integrated one-stop solutions tailored to advanced packaging needs.

A company representative noted, “This shipment proves our wet chemical etching technology is now commercially viable. We plan to expand our full-process glass substrate equipment portfolio to meet rising TGV demand in semiconductor and advanced packaging markets at home and abroad.”

Taesung is also investing in R&D, engineering, solution sales, quality, and manufacturing to stay ahead of fast-evolving technology trends. At its new Cheonan facility, scheduled for completion next year, the company will expand its high-value product mix beyond traditional PCB equipment to include glass substrate and composite copper foil systems—strengthening both its growth and profitability outlook.