Syscom has invested millions of dollars in new equipment in order to achieve the highest quality standard. From simple surface mount designs to complex fine-pitch BGA assemblies and prototype SMT construction to high volume assembly, our state of the art equipment can handle it all.

We have increased our capacity by 3X and lowered labor costs with fully automated production lines.

Our top of the line equipment utilizes dual gantry technology and is an all-in-one platform:

● Inspect and test component placements as small as 01005

● Pick and place 65,000 components per hour

● 100% BGA Laser Inspection

● Automated selective solder equipment for today’s mixed technology

● Fully Automated SMT Production Lines

● Latest automatic optical inspection technology