Today, SK Hynix announced that it has completed the development and internal certification of its next-generation high-bandwidth memory 4 (HBM4) and established a production system ready for mass deployment. The South Korean chipmaker, a key supplier to Nvidia, said it aims to begin volume production of 12-layer HBM4 products in the second half of this year.

The company highlighted that HBM4 delivers industry-leading speed and efficiency. By doubling input/output terminals to 2,048 compared with the previous generation, HBM4 doubles bandwidth and improves power efficiency by more than 40%. SK Hynix estimates the new chips can enhance AI service performance by up to 69%, easing data bottlenecks while cutting power costs for data centers.

Joohwan Cho, Head of HBM Development at SK Hynix, called the achievement a milestone for the industry. “Completing HBM4 development will be a turning point in high-performance AI memory. By supplying products that meet customer demands in performance, energy efficiency, and reliability, we will maintain both delivery speed and competitive advantage," he said.

The company has achieved operating speeds above 10Gbps, far surpassing the JEDEC standard of 8Gbps. To ensure production stability, HBM4 incorporates the proven Advanced MR-MUF packaging process and SK Hynix's fifth-generation 10nm-class (1bnm) process technology.

Justin Kim, President and Head of AI Infrastructure at SK Hynix, emphasized the broader significance: “We are announcing the world's first mass production-ready HBM4 system. As a breakthrough in AI infrastructure, HBM4 will become the core product to overcome the industry's toughest challenges. We will grow into a full-stack AI memory solutions provider by delivering high-quality, high-performance products on time."

Market analysts expect SK Hynix to maintain its leadership in the HBM sector, projecting a market share in the low 60% range through 2026 thanks to its first-mover advantage. Shares of SK Hynix rose as much as 7.3% to a record high following the announcement, outpacing the benchmark KOSPI's 1.2% gain.

Competitors are also moving forward. Samsung said in July it had shipped HBM4 samples with plans for supply next year, while Micron is developing its own customer-specific versions. Unlike previous HBM generations, HBM4 products now integrate customized logic dies, making memory components from different suppliers less interchangeable.

With AI adoption fueling explosive demand for faster and more efficient memory, SK Hynix's early move into HBM4 positions it at the center of the next wave of AI infrastructure development.