On July 16, 2025, Japan's Shinko Electric Industries announced that its Kohoku and Wakaho plants in Nagano City have received IATF 16949 certification as of June 17. The certification, granted by Bureau Veritas, covers the design and manufacturing of flip chip substrates used in CPU and GPU packaging, particularly for automotive applications.

IATF 16949 is an international quality management standard for the automotive industry, developed based on ISO 9001 with additional automotive-specific requirements. It is widely recognized as a global benchmark for quality by leading automakers and suppliers.

Head Office/Kohoku Plant

Demand for automotive semiconductors is growing rapidly with the rise of car electronics, ADAS (advanced driver-assistance systems), and autonomous driving technologies. Shinko's flip chip packages are already used in applications where high reliability is essential. As CPU and GPU performance continues to advance, the need for high-density, high-reliability substrates becomes even more critical.

To meet these evolving demands, Shinko has implemented a quality management system in line with IATF 16949 and successfully passed certification for its First PLP Division's Kohoku and Wakaho plants. The company stated that it will continue to pursue quality improvements and stable supply of high-performance substrates to global customers.

Certification Details

 ● Standard: IATF 16949 (1st edition)

 ● Certification Body: Bureau Veritas Certification Holding

 ● Certification Numbers:

       ● Kohoku Plant: IATF 0575619 / BV JP026388-1

       ● Wakaho Plant: IATF 0575676 / BV JP026388-2

 ● Certification Scope: Design and manufacturing of substrates for IC packages

 ● Certified Entities: First PLP Division, Shinko Electric Industries Co., Ltd.