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Rumien to Invest $400 Million in Mass Production Line for Glass Substrates

South Korean startup Rumien has signed a KRW 520 billion (approximately USD 376 million or CNY 2.7 billion) investment agreement with Gyeongsangbuk-do Province and the city of Gumi to establish a mass production line for next-generation semiconductor glass substrates. The memorandum of understanding was signed on July 28 at Gumi City Hall.

Founded in June 2025, Rumien is an innovation-driven startup led by young local engineers. It aims to localize the production of glass-based interposers and test sockets—key components for high-performance semiconductors. These glass substrates are gaining attention as advanced packaging materials that significantly outperform traditional ceramic substrates in terms of speed, power efficiency, and miniaturization.

Under the investment plan, Rumien will begin prototype testing and line design in December 2025, followed by large-scale facility expansion through 2028. The company expects to create over 1,000 new jobs by 2030.

The startup has already completed verification of its prototypes and built a vertically integrated production system. With this investment, Rumien aims to secure a competitive edge in the global market for glass substrate technologies. The company also plans to strengthen its regional presence by hiring local talent and building a collaborative industrial ecosystem.

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Gyeongsangbuk-do Vice Governor for Economic Affairs Yang Geum-hee emphasized the significance of the deal, stating, “Rumien's investment will be a springboard for positioning Gumi as a global hub for advanced semiconductor materials.” Gumi Mayor Kim Jang-ho added that the city will offer full administrative support to ensure Rumien's successful settlement and growth.

The investment marks another milestone for the Gumi semiconductor cluster, which already hosts key players like SK Siltron, Rusem, and KC. With Rumien's entry, the region continues to build momentum toward becoming a global center for semiconductor materials and components.

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