Japan's Rapidus is making waves in the semiconductor industry as newly leaked data suggests that its 2nm process, known as 2HP, achieves logic densities comparable to TSMC's upcoming N2 node and significantly higher than Intel's 18A.

According to information shared by industry watcher @Kurnalsalts on social platform X and reported by Wccftech, Rapidus's 2HP node is said to reach a logic density of 237.31 MTr/mm², nearly identical to TSMC N2's 236.17 MTr/mm². By comparison, Intel's 18A is estimated at just 184.21 MTr/mm², underscoring a notable gap in density despite Intel's aggressive push with advanced technologies.

The leak also detailed the underlying design choices. Rapidus 2HP reportedly uses a high-density (HD) cell library with a cell height of 138 tracks and a G45 pitch. This approach aligns closely with TSMC's N2 methodology, suggesting both nodes are tuned for maximum logic density, with transistor counts expected to be comparable once final products debut.

Intel's lower reported density for 18A, despite employing an HD library, is attributed in part to its use of backside power delivery (BSPDN). While BSPDN enables performance and power efficiency gains, it also occupies some front-side metal layers, reducing effective logic density. Intel has long emphasized performance-per-watt over pure density, with 18A primarily targeted at internal manufacturing needs.

For Rapidus, the figures represent a breakthrough moment. The company, a government-backed initiative aiming to reestablish Japan's semiconductor leadership, has attracted attention from industry giants including NVIDIA. Its 2HP process incorporates single-wafer front-end processing, a distinctive approach designed to optimize small-volume production before scaling.

Rapidus plans to make its 2nm PDK available to customers in the first quarter of 2026, with mass production targeted for 2027. If the reported density metrics hold true, the Japanese entrant could emerge as a serious contender in the 2nm race—challenging TSMC directly and carving out a unique position in a field long dominated by Taiwanese and U.S. chipmakers.