A South Korean semiconductor and display equipment maker,  Philoptics (KOSDAQ: 161580), announced that it will unveil its newly developed Through Glass Via (TGV) inspection system at the upcoming KPCA Show 2025, taking place from September 3–5 at Songdo Convensia in Incheon. he KPCA Show is an international exhibition for the PCB and semiconductor packaging industry, organized by the Korea Printed Circuit Association and hosted by KYexpo. The company will exhibit the actual inspection system, conduct live demonstrations, and showcase processed glass substrate samples, highlighting its growing competitiveness in the semiconductor glass substrate market.

In addition to semiconductor applications, glass substrate processing has become an increasingly important technology for the printed circuit board (PCB) and advanced packaging industries, where demand for higher density, thinner form factors, and enhanced reliability continues to grow. Philoptics has previously presented glass substrate samples processed with its proprietary TGV technology, including multi-sized hole drilling and cavity thickness control, underscoring its capability to support both PCB and semiconductor integration.

Due to space limitations, Philoptics will also present 3D models of its TGV processing and singulation equipment, both of which have already been delivered to multiple customers. The company emphasized that these tools embody its advanced laser processing and optical design technologies. The TGV equipment drills microscopic holes into bare glass substrates to create electrode pathways, a critical step that directly impacts production yield. Singulation systems, meanwhile, cut multi-layered glass substrates into individual chips, a challenging process given the stress and defect risks associated with stacked materials.

Philoptics has built a comprehensive glass substrate equipment portfolio, including TGV systems, direct imaging (DI) exposure tools, ABF (Ajinomoto Build-up Film) drilling machines, singulation systems, and the new TGV inspection tool. By supplying these core process solutions to leading players across the global glass substrate and PCB value chains, the company has steadily secured new orders and shipments each quarter.

A company representative noted, "As the glass substrate business becomes a key growth driver, it is essential to communicate our differentiated achievements effectively. By displaying processed glass samples, equipment models, and live demonstrations, we aim to showcase our technological leadership to both domestic and international customers."