On October 17, 2025, NVIDIA and Taiwan Semiconductor Manufacturing Co. (TSMC) announced the successful production of the first NVIDIA Blackwell wafer at TSMC's Fab 21 facility near Phoenix, Arizona — marking a historic milestone in U.S. semiconductor manufacturing.

"This is a historic moment for several reasons," said NVIDIA CEO Jensen Huang, who attended the commemorative event at Fab 21. "It is the very first time in recent American history that the single most important chip is being manufactured here in the United States by the most advanced fab, by TSMC. This is the vision of President Trump's reindustrialization — to bring back manufacturing to America and create jobs. This is the most vital manufacturing industry and the most important technology industry in the world."

During the ceremony, Huang and TSMC Vice President Y.L. Wang signed a Blackwell wafer to celebrate the achievement, underscoring how the core engine of AI infrastructure is now being built on U.S. soil.

According to TSMC Arizona CEO Ray Chuang, "From our arrival in Arizona to delivering the first U.S.-made NVIDIA Blackwell wafer in just a few years represents TSMC at its best. This milestone builds on three decades of collaboration with NVIDIA — pushing technological boundaries together — and on the dedication of our employees and local partners who made TSMC Arizona possible."

The first U.S.-produced Blackwell wafer was manufactured using TSMC's 4N process, a custom 4nm-class node designed for NVIDIA's AI GPUs. The accomplishment demonstrates that TSMC's Arizona plant is capable of fabricating one of the most complex chips ever made, with yields reportedly improving to match those of its fabs in Taiwan.

The milestone fulfills a key goal of U.S. industrial policy under the CHIPS Act: advancing domestic semiconductor production to reduce reliance on overseas manufacturing. For NVIDIA — now the world's most valuable company, with a market capitalization exceeding US$4.5 trillion — producing a flagship chip in the U.S. carries both symbolic and strategic weight.

For Washington, the development is politically significant. For decades, the world's most advanced chips were designed in the U.S. but manufactured almost exclusively in Taiwan — a geopolitical risk. The Blackwell wafer's U.S. production provides a tangible outcome from years of incentives and pressure aimed at reshoring advanced manufacturing.

However, the newly produced wafers must still be shipped back to Taiwan for CoWoS-L advanced packaging with HBM3E memory before becoming deployable AI chips. Because TSMC does not yet have an advanced packaging plant in Arizona — and Amkor's facility in the state is still under construction — final assembly remains dependent on Taiwan. This adds cost and complexity, leaving the U.S. milestone largely symbolic in strategic terms.

TSMC confirmed that Fab 21 currently produces 4nm chips and will later expand to 3nm, 2nm, and A16 (1.6nm) process technologies — all critical for AI, high-performance computing (HPC), and telecommunications applications. The company plans to establish three fabs in Arizona, with the first 4nm fab now in production, the second 3nm fab expected to begin mass production by 2028, and a third facility targeting 2nm or A16 production around 2029–2030.

In March 2025, TSMC further announced an additional US$100 billion investment in the U.S., which includes plans for three new fabs, two advanced packaging plants, and a major R&D center — all still in the early planning stages.

TSMC CEO C.C. Wei recently confirmed during the company's Q3 earnings call that production has begun at Fab 21 for key American clients, supported by strong cooperation with both customers and the U.S. government. TSMC plans to accelerate its technology roadmap in Arizona to meet surging AI demand and establish a "Gigafab cluster" capable of supporting smartphone, AI, and HPC applications.

The first Blackwell wafer built in the U.S. symbolizes a major turning point — not only for NVIDIA and TSMC, but also for America's semiconductor ambitions. While final chip packaging remains offshore, this milestone signals the return of cutting-edge chip fabrication to U.S. soil and the deepening technological partnership between the world's AI leader and the world's top foundry.