Micron Technology announced on June 12 (local time) that it will invest approximately $200 billion to expand its U.S. memory chip manufacturing and R&D operations, in coordination with the Trump administration. The plan includes $150 billion in domestic manufacturing and $50 billion for research and development, and is expected to create around 90,000 direct and indirect jobs.

As part of this initiative, Micron will invest an additional $30 billion beyond prior plans. The expansion includes the construction of a second leading-edge memory fab in Boise, Idaho; upgrades to its existing Manassas, Virginia facility; and the launch of U.S.-based advanced packaging capabilities for High-Bandwidth Memory (HBM), which is crucial to AI applications.

This builds on Micron's previously announced projects, including a $100 billion manufacturing hub in New York and a $25 billion investment in Idaho. Construction of the first Idaho fab is already underway, with production scheduled to begin in 2027. The second Idaho fab is expected to come online before the first New York fab, with site preparation in New York set to begin later this year following federal and state environmental reviews.

Micron has also finalized a $275 million CHIPS Act funding award to support the Virginia expansion, which will include domestic production of its 1-alpha DRAM node. The move is expected to strengthen supply chains across key sectors such as automotive, aerospace, defense, and healthcare.

President Trump's Commerce Secretary, Howard Lutnick, said the administration is working with Micron to "bring the full spectrum of memory chip production back to the United States" and reaffirm U.S. leadership in critical sectors like AI and defense.

Micron's expanded footprint will include up to four fabs in New York and two in Idaho, alongside its R&D center in Boise. The company's goal is to produce 40% of its DRAM output domestically, co-locating production and research to accelerate time-to-market for high-performance memory solutions, particularly HBM for AI workloads.

The investment has received up to $6.4 billion in CHIPS Act funding and is expected to qualify for the Advanced Manufacturing Investment Credit (AMIC). Lawmakers are also considering extending and increasing AMIC to support long-term chip investments.

The announcement drew praise from major tech leaders. NVIDIA CEO Jensen Huang said the move “is an important step forward for the AI ecosystem.” Apple CEO Tim Cook, AMD CEO Lisa Su, and executives from Microsoft, Dell, AWS, and Qualcomm also voiced strong support, citing the initiative's impact on innovation, supply chain security, and U.S. competitiveness.

In parallel, Micron has committed over $325 million to workforce development initiatives in Idaho, New York, and Virginia, including education partnerships, apprenticeships, and university collaborations to build a robust semiconductor talent pipeline.

Micron's CEO Sanjay Mehrotra emphasized that this $200 billion initiative is “critical to ensuring the U.S. remains a global leader in memory technology,” reinforcing economic and national security through domestic production of advanced semiconductors.