On September 30, MacDermid Alpha Electronics Solutions and PCB manufacturer Graphic PLC powered up the UK's first horizontal electroless copper metallization line, marking a breakthrough in advanced surface fabrication and additive manufacturing that could enable new PCB form factors and more efficient electronic designs.

The installation was completed in March at Graphic's facility in Crediton, Devon, in partnership with SCHMID Group as the equipment supplier and MacDermid Alpha as the chemistry provider. The system is based on MacDermid Alpha's Via Dep 4550 electroless copper technology, designed for challenging substrates and complex PCB structures.

Via Dep 4550 delivers high adhesion on inert surfaces and difficult designs, while providing stress-free, blister-free deposits suitable for SAP, mSAP, and flexible circuit applications. It also meets IPC-TM-650 thermal stress standards for plated through-holes, ensuring reliability in advanced PCB manufacturing.

Hans Vrijhof, Business Manager UK & Benelux at MacDermid Alpha, said the project underscores the company's commitment to advancing PCB technologies: "Our Via Dep 4550 system provides high adhesion and structural integrity, making it ideal for complex substrate designs."

Graphic PLC Technical Manager Andy Greasley added: "The installation of this cutting-edge process at our Crediton site will significantly boost our production capacity and technical capability, while reinforcing Graphic's position as Europe's leading PCB manufacturer."

Roland Rettenmeier, CSO of SCHMID Group, emphasized the collaborative effort, noting the project's importance in advancing PCB manufacturing in the UK and Europe.