South Korea's (KRX: 051910) is accelerating its push into next-generation semiconductor packaging materials, aiming to broaden its presence in the high-performance PCB and IC substrate markets. The company is positioning advanced 2.3D packaging and glass substrate materials as key growth drivers to overcome the limitations of traditional silicon interposers.

According to industry sources, LG Chem has recently completed development of a liquid-type Photo Imageable Dielectric (PID) and is working on a film-type version. PID is a core insulating material used to form fine circuits connecting semiconductor chips and substrates, ensuring signal precision and enhancing reliability. The company's new PID can be applied not only to conventional package substrates but also to polymer interposers and glass substrates—both viewed as next-generation alternatives to silicon-based packaging.

To prepare for the glass substrate era, LG Chem is also developing plating materials designed for through-glass via (TGV) and circuit formation processes. This effort aligns with LG Innotek's recent expansion into glass substrate manufacturing, signaling a group-level strategy to strengthen its semiconductor packaging value chain.

At the same time, LG Chem is expanding its semiconductor materials portfolio to include copper-clad laminates (CCL), build-up films (BUF), die attach films (DAF), and non-conductive films (NCF) for high-bandwidth memory (HBM) packaging. These materials are essential for achieving high-density interconnects, multilayer structures, and improved thermal reliability—technologies increasingly demanded by advanced PCB and substrate makers.

By leveraging its core polymer and chemical expertise, LG Chem aims to capture new opportunities in the rapidly converging PCB and semiconductor packaging markets. The company's entry into 2.3D and glass substrate materials marks a significant step toward establishing itself as a key upstream supplier in the advanced electronics materials ecosystem.