中文
Home / IC News

Leaked iOS 18 Code Reveals Apple Developing at Least 7 New Chips Across iPhone, Mac, and Watch

Apple is reportedly developing at least seven new in-house chips, according to internal iOS 18 build data recently shared by a developer on the Chinese video platform Bilibili. The unannounced chips include the A19, A19 Pro, M5, M5 Pro, a new Apple Watch chip, the second-generation 5G modem (codenamed C2), and a new wireless communication chip named Proxima.

The A19 chip is expected to power the upcoming iPhone 17 Air, codenamed “Tilos,” while the A19 Pro—codenamed “Thera” with system identifier T8150—is designed for the iPhone 17 Pro and Pro Max. This reflects Apple's continued strategy of using distinct high-end processors for its flagship models, reinforcing product segmentation and hardware differentiation.

On the Mac front, Apple is preparing to update its 14-inch and 16-inch MacBook Pro lineup after the iPhone 17 launch. These refreshed laptops are expected to feature new M5 and M5 Pro chips, codenamed “Hidra” and “Sotra,” respectively, continuing Apple's custom silicon advancement in the Mac ecosystem.

For wearables, Apple plans to introduce a new chip, codenamed “Bora,” with the upcoming Apple Watch Series 11. Based on the A18 architecture, the chip is likely to offer improved AI capabilities and performance, helping Apple maintain its lead in the smartwatch market.

UCE GROUP

The leaked code also reveals that Apple is advancing efforts to reduce reliance on third-party suppliers. The C2 modem is the company's second-generation 5G baseband chip, expected to replace the Qualcomm-supplied C1 in the upcoming iPhone 17e models in 2025. This is part of Apple's broader strategy to strengthen its in-house connectivity solutions.

Another notable addition is the Proxima chip, which is designed to integrate Bluetooth and Wi-Fi functionality into a single module. This integration could deliver space savings and better power efficiency, especially in compact devices like wearables and future AR/VR products.

Together, these chips reflect Apple's push to deepen vertical integration and optimize performance across its device ecosystem. As the iPhone 17 lineup, new Macs, and next-gen Apple Watch are expected to debut in the second half of the year, the market will soon see how Apple leverages its chip innovations to enhance cross-device synergy, performance, and AI capability.

Phone

+86 191 9627 2716
+86 181 7379 0595

Working Hours

8:30 a.m. to 5:30 p.m., Monday to Friday

Copyright © 2023 HuNan Printed Circuit Association of ChinaSite mapPrivacy PolicyPowered by Bontop

Contact Us