On July 22, IVW Co., Ltd. (Intelligent Vision Works), a South Korea-based specialist in vision inspection systems for secondary batteries and semiconductors, announced it has filed a patent for a next-generation optical inspection technology capable of detecting micro-defects in glass substrates—an emerging key material for advanced IC substrates and AI chip packaging.

The patented system uses a multi-projection optical setup that enables a pseudo-3D, non-destructive inspection approach. It can detect a wide range of defects including via hole irregularities, microcracks, scratches, foreign particles, and stains on glass substrates. According to IVW, no similar prior patent has been identified, reinforcing the novelty of its solution.

The company began developing the technology in 2023 and plans to formally enter the semiconductor and glass substrate inspection equipment market. With multiple glass core and interposer manufacturers preparing for mass production, demand for precise, high-throughput inspection solutions is rising. IVW is currently in discussions with major equipment partners to commercialize the system.

“Our goal is to develop a full-process inspection solution for AI semiconductor glass substrates—from laser drilling to via plating,” said an IVW spokesperson. “We have completed optical simulations for through-glass via (TGV) microcrack inspection and are preparing additional patent filings.”

Following the announcement, IVW's stock surged to the upper limit on the Korea Exchange, closing 29.98% higher at KRW 1,253.

According to Global Market Insights, the global glass substrate market is valued at approximately USD 7.2 billion in 2024 and is expected to grow to USD 10.3 billion by 2034, driven by demand from AI semiconductors, displays, and photovoltaic technologies. Asia-Pacific, led by South Korea, China, and Japan, dominates the market in both technological capability and manufacturing infrastructure.

By introducing advanced defect detection for glass substrates, IVW is positioning itself as a key enabler in the rapidly evolving ecosystem of next-generation packaging and IC substrate manufacturing.