Intel has begun licensing its semiconductor glass substrate technology, according to South Korean outlet ETNews, marking a significant shift in the company's approach to next-generation packaging. Instead of focusing on in-house production, Intel is now engaging with glass substrate makers and suppliers of materials, parts, and equipment, and is considering granting usage rights under time-limited agreements in exchange for royalties.

Industry sources suggest this pivot reflects Intel's broader struggles in its foundry operations. With mass adoption of glass substrates not expected until around 2030, licensing offers the company an interim path to monetize its technology while shaping the ecosystem.

Despite scaling back direct manufacturing ambitions, Intel is not expected to abandon glass substrates. Its licensing push could instead foster collaborations across the industry. Major chipmakers including Samsung Electronics, AMD, Broadcom, and Amazon are already moving toward glass substrate adoption, and Intel is anticipated to follow.

Analysts also believe the move could accelerate commercialization industrywide. By opening access to its extensive patent portfolio, Intel may enable latecomers to advance their development more rapidly, while repositioning itself as a potential customer rather than a direct competitor. This could create new opportunities for suppliers such as Samsung Electro-Mechanics and Absolics.

Meanwhile, global players are racing ahead with commercialization. Absolics, a subsidiary of SKC, has begun prototype production at its new facility in Georgia, U.S., with annual capacity of 12,000 square meters. The company expects to complete mass production preparations by the end of 2025, potentially becoming the first to commercialize glass substrates.

Samsung is also accelerating efforts, with The Korea Herald reporting plans to adopt glass substrate interposers for advanced semiconductors by 2028 to meet customer demand. The company has already launched a pilot line at its Sejong facility.