Intel has reiterated that its glass substrate development roadmap remains unchanged, dismissing speculation it may exit the business amid financial headwinds. The company told ETNews that its plans, first announced in 2023, are on track and that it will not comment on market rumors regarding restructuring or staff cuts.

According to industry sources, Intel has already built a pilot supply chain with partners in Korea, Japan, and Taiwan, targeting pilot line operations in 2025. However, the company has yet to finalize decisions on mass production. Observers note that large-scale investment and multiple manufacturing partners will be required to ensure stable supply, leaving it uncertain whether Intel will produce substrates in-house or rely on external suppliers.

Intel's roadmap calls for introducing glass substrates before 2030, replacing conventional organic substrates to enable higher performance chips needed for AI and other advanced applications. The company highlighted that it has invested over a decade in glass substrate R&D and previously announced plans for a pilot production line.

Speculation about Intel's withdrawal surfaced after recent earnings weakness and workforce restructuring, but the company's latest remarks indicate its glass substrate adoption program remains active. Industry analysts believe Intel has accumulated significant know-how in glass substrate technologies, strengthening its position in next-generation packaging.

Meanwhile, rivals are accelerating their efforts. Samsung is reportedly exploring cooperation with Intel and aims to adopt glass substrate interposers for advanced semiconductors by 2028, with a pilot line already running at its Sejong facility. Absolics, an SKC subsidiary, expects to complete mass production preparations by late 2025 and has already begun prototype production at its Georgia, U.S., plant, positioning itself as a potential first mover in commercialization.

The global race underscores glass substrates' growing importance in semiconductor packaging. While challenges remain in scaling production, momentum is building across the supply chain as major players push to secure leadership in this next-generation technology.