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Micron's $100B Mega Fab Reportedly Delays Again, with Groundbreaking Pushed to Late 2025

Micron Technology's ambitious $100 billion DRAM manufacturing campus in Clay, New York, has reportedly been delayed again, with groundbreaking now expected in late November or December 2025—well behind the original target of June 2024. According to local reports from syracuse.com and The Daily Orange, the latest delay stems from a holdup in the environmental review process.

Originally announced in October 2022, Micron's mega fab is projected to be the largest semiconductor manufacturing facility in U.S. history, spanning two decades and expected to generate up to 50,000 direct and indirect jobs. The campus is set to include four cleanrooms totaling 600,000 square feet—eight times larger than GlobalFoundries' Fab 8 in Malta, New York.

This marks the fourth reported delay for the Clay facility. Syracuse.com noted that both the U.S. Department of Commerce and Onondaga County's development agency requested more time to complete the site's draft environmental impact statement, which is now expected to be released on June 25.

Micron's Clay project is a centerpiece of its strategy to shift 40% of global DRAM production to the United States by the mid-2030s, alongside its existing operations in Boise, Idaho. The company has already secured $6.1 billion in CHIPS and Science Act funding and committed $15 billion to its Boise fab, while expanding its Manassas, Virginia site as part of its nationwide buildout.

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However, the repeated delays are raising concerns. SemiAnalysis previously estimated that postponements at such a scale could cost the company as much as $5 million per day in opportunity costs. Beyond regulatory hurdles, the site faces ecological complications: Bloomberg reports that two endangered bat species were found at White Pine Commerce Park, where the fab is slated to be built. Micron reportedly plans to mitigate the issue by relocating the animals to protected habitats.

Despite the setbacks, Micron continues to advance in memory technology. On June 10, it announced the shipment of 36GB 12-high HBM4 samples to key customers, including NVIDIA. Additional reports from the Korea Economic Daily suggest Micron has also been tapped to supply next-generation SOCAMM modules for AI server deployments.

Still, the delay in Clay clouds the outlook for Micron's U.S. manufacturing roadmap. Until it receives final approval—including from the U.S. Army Corps of Engineers to proceed with development on protected wetlands—Micron's most ambitious American project remains stuck in neutral.

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