中文
Home / IC News

HT-Tech to Invest $277 Million in New 2.5D/3D Advanced Packaging Subsidiary

On August 1, Chinese semiconductor packaging leader HT-Tech announced it will invest RMB 2 billion (approximately $277 million) to establish a new wholly owned subsidiary focused on advanced packaging and testing, marking a major step forward in the company's strategic expansion into 2.5D and 3D semiconductor technologies.

The new company, named Nanjing HT Advanced Packaging Co., Ltd. ("HT Advanced"), will be jointly funded by HT-Tech's wholly owned subsidiaries: HT-Tech Jiangsu (50%), HT-Tech Kunshan (33.25%), and the affiliated investment partnership Advanced No.1 Fund (16.75%). The registered capital totals RMB 2 billion.

HT Advanced will specialize in advanced semiconductor packaging technologies, particularly 2.5D and 3D integration, which are becoming increasingly critical for applications in AI, high-performance computing, data centers, and next-generation communications.

HT-Tech stated that this move will enhance its competitiveness in the advanced packaging space, accelerate development efforts, expand production capacity, and increase market share. The company aims to reinforce its leadership position in the global IC packaging and testing market.

ASK PCB (Aoshikang Technology)

The announcement comes as the global semiconductor industry shifts toward heterogeneous integration, with 2.5D/3D packaging emerging as a key enabler for sustaining Moore's Law amid rising costs of sub-7nm nodes. Advanced packaging allows for improved performance, higher chip density, and reduced power consumption without relying solely on node scaling.

According to Yole Intelligence, the global advanced packaging market is projected to reach $56.9 billion in 2025, growing at a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028. By 2027, advanced packaging is expected to surpass traditional packaging in market share for the first time.

With major global players such as TSMC, Intel, and Samsung also prioritizing advanced packaging strategies, HT-Tech's latest investment positions it to compete more effectively in the evolving semiconductor landscape.

Phone

+86 191 9627 2716
+86 181 7379 0595

Working Hours

8:30 a.m. to 5:30 p.m., Monday to Friday

Copyright © 2023 HuNan Printed Circuit Association of ChinaSite mapPrivacy PolicyPowered by Bontop

Contact Us