On July 17, 2025, Japanese deep-tech startup Elephantech announced the launch of a groundbreaking 15 nm-class copper nanofiller—the smallest commercially available of its kind worldwide. This innovation positions Elephantech among the first companies to offer such advanced materials for commercial applications.

Developed through years of proprietary R&D, the nanofiller consists of ultra-fine, uniformly distributed copper particles with an average diameter of 15 nm. It features excellent dispersion stability lasting over six months and supports low-temperature wet reduction at just 60°C, simplifying processing for end users.

TEM image of Elephantech's copper nanofiller

Particle size distribution measurement result

Key Specifications (Semi-solid Form):

 ● Average particle diameter: 15 nm

 ● Viscosity: 100–1,000 Pa·s (25°C)

 ● Specific gravity: 3.2–3.5 g/cm³

 ● Solid content: 55–85 wt%

 ● Supply form: Glycol ether-based, adaptable to other solvents for use in inks and pastes

The material offers high electrical and thermal conductivity, low resistivity, and broad compatibility with various applications—including conductive inks, pastes, and next-generation electronic components.

Since launch, Elephantech has received strong interest from manufacturers looking to integrate the material into their products. The company aims to set new benchmarks in nanomaterial performance while expanding its portfolio beyond its core expertise in printed circuit board (PCB) development.

With a foundation in sustainability-driven innovation, Elephantech continues to push the boundaries of electronics manufacturing and materials science.