Davolink and IPS have formalized a partnership to jointly develop metal PCB–based thermal management solutions aimed at high-heat environments such as data centers and public Wi-Fi infrastructure.

Under the collaboration, IPS will lead process and manufacturing innovation, while Davolink will focus on commercialization, customer engagement, and market expansion. The companies aim to validate the technology through sample production, proof-of-concept testing, and customer approval processes, with plans to pursue eco-friendly GR certification domestically and IPC/JEDEC compliance overseas.

The solution replaces conventional FR4 with aluminum substrates that directly print copper circuitry, enabling faster heat spreading at the board level. This design reduces thermal bottlenecks in server power units, PDBs, VRMs, and DC-DC converters, easing system cooling demands. In manufacturing, wet chemical processes are substituted with plasma, laser, and vacuum deposition methods to cut wastewater and hazardous byproducts, addressing both ESG concerns and global supply chain sustainability requirements.

Davolink noted that demand for high-thermal-conductivity MCPCBs is growing rapidly, driven by the surge in AI-related data center power consumption. Market reports project the MCPCB segment to reach up to $31.7 billion by 2030, fueled by adoption in power electronics and high-heat components. Metal PCBs also offer recyclability advantages over FR4, lowering supply chain ESG risks.

Beyond hardware, the two companies plan to integrate AI with high-thermal PCBs in public Wi-Fi access points, creating predictive disaster and safety alert networks. This roadmap could expand from municipal pilot projects to national-scale infrastructure deployments.

Both firms emphasized that the initiative represents more than a product launch, positioning metal PCBs as a potential new industry standard. By combining measurable performance and sustainability benefits, Davolink and IPS aim to expand collaboration into higher-level system integration and chip co-design in the future.