Hualien City in Taiwan experienced a magnitude 7.2 earthquake

Following the earthquake that registered a maximum seismic intensity of 7.2 in eastern Taiwan, some companies from Japan with offices in Taiwan experienced damages such as wall cracks.

An earthquake originating off the eastern coast of Taiwan before 9 a.m. Japan time on the 3rd prompted a 7.2 seismic intensity in Hualien in the east, leading to a temporary tsunami alert in the Okinawa region.

According to investigations in Nagano Prefecture, the manufacturing sector from the prefecture has established 56 facilities in Taiwan as of 2022.

SHINKO ELECTRIC INDUSTRIES, headquartered in Nagano City, had its Taipei office building affected by the seismic intensity of "Weak 5," causing wall cracks and elevator stoppages.

No injuries were reported among the staff.

As of the evening, the prefecture stated that no reports of damage related to local companies had been received.

About SHINKO 

SHINKO ELECTRIC INDUSTRIES CO., LTD. is a Japanese company founded in 1946.“integrated Thin film High density Organic Package (i-THOP®)” developed by SHINKO is an FC-BGA substrate that assembles an ultra-fine wiring layer formed through high density wiring technology and thin-film technology with a build-up substrate. The ultra-fine wiring layer of i-THOP® enables the assembly of multiple logic chips and heterogeneous integrations, such as logic chips and high bandwidth memory (HBM). SHINKO will be introducing i-THOP® to the market as a next-generation FC-BGA substrate that meets the needs of the high-performance computing (HPC) market, which is expected to experience significant growth in the medium-to long-term. i-THOP is a registered trademark of SHINKO ELECTRIC INDUSTRIES CO., LTD.

Additionally, it's worth mentioning that SHINKO obtained the IATF 16949 Certification, an international quality management system standard for the automotive industry, for the design and manufacture of plastic BGA substrates for semiconductor memory. Automotive semiconductors are in high demand as key components in-car electronics, and SHINKO’s plastic BGA substrates are used as highly dependable semiconductor package substrates for automobiles.

Editor：Lulu

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