On the evening of May 22, Beijing Time, Xiaomi officially launched China's first 3nm smartphone chip—the "XRING O1"—at its "New Start" strategy event in Beijing. The chip will power Xiaomi's new flagship devices, including the Xiaomi 15S Pro smartphone and Xiaomi Pad 7 Ultra. With this launch, Xiaomi becomes the fourth smartphone maker globally—after Apple, Samsung, and Huawei—and the second in China to develop its own flagship SoC.

CEO Lei Jun declared that the success of both the XRING O1 and the company's first 4G smartwatch chip, the XRING T1, marks Xiaomi's entry into full-stack chip design.

Built on TSMC's Advanced 3nm Process

The XRING O1 is built on TSMC's second-generation 3nm N3E process—the same technology used in the Snapdragon 8 Gen3 Elite Edition and MediaTek Dimensity 9400. N3E offers 15–20% performance gains or 30–35% lower power consumption compared to the previous 5nm process. The XRING O1 contains 19 billion transistors, fewer than the Dimensity 9400's 29.1 billion, largely because the XRING O1 excludes a built-in modem.

With a die size of 109mm², the XRING O1 is fabricated by TSMC and, at 19 billion transistors, falls well below U.S. export control thresholds targeting AI and datacenter chips with more than 30 billion transistors. Xiaomi confirmed the chip has already entered mass production.

Custom 10-Core CPU Architecture Outperforms Dimensity 9400 in Multi-Core

Rather than follow the trend of all-big-core designs, Xiaomi opted for a 10-core CPU layout (2+4+2+2), combining performance and power efficiency. The setup includes:

2× Cortex-X925 (3.9GHz)

4× Cortex-A725 (3.4GHz)

2× Cortex-A725 efficiency cores (1.9GHz)

2× Cortex-A520 efficiency cores (1.8GHz)

Benchmark scores show the XRING O1 achieving 3,008 (single-core) and 9,509 (multi-core) on Geekbench—on par with the Dimensity 9400 and ahead of Apple's A18 Pro in multi-core performance.

The chip also features 10.5MB of L2 and 16MB of L3 cache and includes Xiaomi's in-house microcontroller and adaptive voltage scaling (AVS), achieving industry-leading CPU voltage of just 0.46V.

16-Core Immortalis-G925 GPU Delivers Smooth Gaming Performance

The XRING O1 integrates a 16-core Immortalis-G925 GPU—four more cores than the Dimensity 9400. It supports 120fps in popular mobile games and improves ray tracing performance by 52% over the previous generation.

In GFXBench tests:

1440p Aztec Ruins Vulkan: 110 FPS

1080p Manhattan 3.1: 330 FPS

While slightly behind Dimensity 9400 and Snapdragon 8 Gen3 Elite in GPU performance, the XRING O1 beats Apple's A18 Pro and boasts 35% lower GPU power consumption thanks to dynamic performance scaling. In real-world MOBA gaming tests, the Xiaomi 15S Pro maintained higher average frame rates and lower temperatures than the iPhone powered by A18 Pro.

Advanced Imaging and AI Capabilities

XRING O1 features Xiaomi's fourth-generation ISP, capable of processing 8.7 billion pixels per second. It supports triple-pipeline Raw image processing, real-time HDR fusion, and per-frame AI video noise reduction. Xiaomi claims a 20× improvement in signal-to-noise ratio for 4K night video.

On the AI front, the chip includes a 6-core NPU with 44 TOPS of compute—surpassing the A18 Pro's 35 TOPS. The NPU accelerates over 100 frequently used AI operators and supports Xiaomi's third-generation on-device AI model.

Antutu Score Tops 3 Million

The XRING O1 achieved a total Antutu score of over 3 million (3,004,137), placing it alongside top-tier chips like the Dimensity 9400 and just behind the Snapdragon 8 Gen3 Elite. While the test environment was not specified, the result affirms Xiaomi's position in the flagship SoC arena.

Conclusion: XRING O1 Joins the Top Tier

With custom architecture, a 3nm TSMC node, competitive CPU/GPU/NPU performance, and strong power efficiency, the XRING O1 represents a major milestone for China's semiconductor ambitions and places Xiaomi firmly among the elite global smartphone SoC designers.