South Korean mid-sized equipment maker C&G Hi Tech (KOSDAQ: 264660), a leading supplier of chemical central supply systems (CCSS) for semiconductor and display fabs, has successfully developed a next-generation large-area glass PCB substrate through its proprietary Modified Physical Vapor Deposition (M-PVD) process.

According to the company's announcement on August 21, the newly developed glass PCB substrate features an aspect ratio of 1:7.5, a via density of 2,000 holes per cm², and resistance below 0.1Ω/cm², representing one of the most advanced structures in the field. Measuring 510×515 mm², the substrate enables the stable formation of high-adhesion copper thin films with complex geometries on glass surfaces.

C&G Hi Tech enhanced conventional DC sputtering-based PVD processes to develop the M-PVD method, which maintains high crystallinity while being environmentally friendly. The key advantage lies in its ability to form uniform, low-resistance copper films even on irregular via surfaces—something difficult to achieve with traditional wet chemical processes.

The company highlighted three key technical advantages of the new development:

 1. High adhesion strength exceeding 7 N/cm between copper and glass substrates via ion beam surface treatment.

 2. Precise copper deposition inside through-via walls using the M-PVD process.

 3. Improved process stability and productivity through integrated process optimization.

Conventional wet chemical plating processes have faced challenges such as toxic waste generation, unstable processing for complex shapes, poor reproducibility, and high costs. C&G Hi Tech's dry-based M-PVD process addresses these issues fundamentally, offering a green, high-reliability, and high-yield manufacturing method for next-generation glass PCBs designed for high-density circuitry.

The company plans to establish a continuous production line integrating ion beam surface treatment, metal thin-film deposition, and post-annealing (below 200°C), paving the way for mass production. C&G Hi Tech had also showcased the developed large-area glass substrate at the KPCA Show 2025, held from September 3–5 in Songdo, Incheon, and had provided samples to potential global customers.

This core technology has already been patent filed, and the company is actively pursuing joint application development with industrial, research, and academic partners in Korea and abroad.

Meanwhile, C&G Hi Tech's share price has risen sharply, closing at ₩16,980 after a 4.04% gain, as investors anticipate strong earnings growth driven by its glass substrate technology. The firm has reportedly completed prototype production and is under technical review by major domestic semiconductor companies Samsung Electronics and SK Hynix, fueling expectations that Korea could overtake Japan and the U.S. in glass substrate commercialization.

Through years of R&D, C&G Hi Tech has independently developed core process technologies such as glass cutting, polishing, and via formation, becoming the first in the world to achieve near-commercialization using purely domestic technology.

The company aims to leverage its glass PCB platform to expand into AI servers and high-performance computing (HPC) markets. Industry analysts note that substrate innovation will be crucial to enhancing Korea's AI semiconductor competitiveness, calling C&G Hi Tech's breakthrough a "turning point for the country's semiconductor ecosystem."

C&G Hi Tech stated, "This environment-friendly, high-integration glass PCB technology will serve as a core foundation for future high-performance electronics, from AI and autonomous driving to defense, aerospace, and high-speed data communication. We plan to strengthen our leadership through continuous technology advancement and international collaboration."