On June 18, 2025, China's leading display panel maker BOE is moving into the semiconductor glass substrate business, aiming to leverage its expertise in display glass technology to expand into advanced semiconductor packaging.

According to China Bidding, BOE has recently placed orders for semiconductor glass substrate equipment, including automated optical inspection (AOI) systems and electroless copper plating tools. The company selected U.S.-based Onto Innovation for the AOI equipment, while choosing domestic suppliers for desmear, electroless plating, and adhesion promotion tools.

The project, officially titled “Glass-Based Packaging Substrate R&D Test Line,” will be led by BOE's subsidiary, Beijing BOE Sensor Technology, and will be built in the Beijing Economic-Technological Development Area. The subsidiary is known for its work in IC manufacturing, telecom equipment, and IoT technology services.

In documents submitted with the tender, BOE stated its intention to purchase glass-based process and exposure equipment to build a test line for the development and industrialization of glass-based IC package substrates. The goal is to validate the process, improve chip performance, and enable large-format packaging—clearly positioning the initiative for semiconductor, not display, applications.

Glass substrates are gaining attention as a next-generation material for high-performance, high-density semiconductor packaging. Compared to traditional substrates, glass offers smoother surfaces, greater dimensional stability under heat, and the potential for finer circuitry. However, the brittle nature of glass makes it highly challenging to process, and no company has yet achieved full commercialization of glass substrates for semiconductor use.

BOE's entry into this field reflects a strategic expansion beyond its core LCD and OLED businesses, as the company seeks new growth opportunities in the semiconductor sector. Glass processing expertise is a key competitive factor in this area, and BOE's background in display manufacturing gives it a potential edge in repurposing its existing supply chain for semiconductor applications.

An industry insider noted that BOE's interest in semiconductor glass substrates has been known since late last year, but the recent equipment orders mark the company's first concrete steps toward building out the business.