On August 14, Austria's AT&S (VIE: ATS) announced its role as a strategic partner in the EU-funded HiPower 5.0 project, aimed at developing compact and intelligent electric drive solutions for sustainable mobility in automotive and shipping. The three-year initiative brings together 45 partners from industry and research, coordinated by AVL List GmbH, including Infineon Technologies, Mercedes-Benz, Siemens, Renault-Ampere, Schaeffler, Valeo, TDK Electronics, and leading universities and institutes such as Fraunhofer IZM, TU Chemnitz, TU Turin, TU Eindhoven, Aalborg University and IMEC.

HiPower 5.0 builds on the achievements of the HiEFFICIENT project and will focus on advanced semiconductor integration and control systems for next-generation electric drives. AT&S will contribute its expertise in high-performance printed circuit board (PCB) technology and semiconductor integration, key to achieving higher efficiency, longer range, and improved durability in e-mobility systems.

"Our contributions to European research initiatives like HiPower 5.0 highlight that AT&S researchers are working at the international forefront. Our technology developments are vital for enabling efficient and sustainable systems for a livable future," said Mike Morianz, Program Manager R&D at AT&S.

AT&S is recognized as a leader in integrating wide bandgap (WBG) semiconductors such as gallium nitride (GaN) and silicon carbide (SiC) into advanced PCBs. These materials deliver smaller, lighter, and more durable power converters with reduced energy and thermal losses, enabling electric vehicles to handle high currents and voltages more efficiently while extending driving range and system lifetime.

With production sites in Austria, China, Malaysia, and India, and a European competence center for R&D and IC substrates in Leoben, AT&S continues to drive innovation in interconnect technologies for industries spanning automotive, aerospace, industrial, medical, and high-performance computing. The company employs around 13,000 people worldwide.