On July 14, 2025, Aoshikang Technology Co., Ltd. (ASKPCB, SHE: 002913), a global leader in PCB manufacturing, held a grand groundbreaking ceremony for its new high-layer and advanced HDI PCB plant at its production base in Zhaoqing, Guangdong. The event marked a significant milestone in the company's strategic roadmap toward high-end intelligent manufacturing.

Chairman Mr. Cheng Yong, Co-Founder Ms. He Bo, General Manager Mr. He Zixiu, Mr. Cheng Songqi, and leaders from various production sites gathered to witness this historic occasion.

At exactly 9:28 a.m. (Beijing time) —an auspicious hour—the ceremony officially commenced with a traditional blessing ritual. Aoshikang executives and honored guests joined in a solemn prayer, expressing hopes for the smooth construction and early operation of the new facility.

Following the ritual, Mr. Cheng Songqi (son of Chairman Cheng Yong), General Manager He Zixiu, and Chairman Cheng Yong delivered keynote speeches.

Mr. Cheng Songqi shared his personal journey, having grown up with the company and witnessed its transformation from humble beginnings into a modern enterprise. Last year, he worked on the front lines, starting with the most basic processes. This hands-on experience gave him a deep appreciation for the complexity of manufacturing and the resilience and cohesion of the ASKPCB team. He emphasized that this project is more than just the construction of a new facility—it represents a strategic shift toward high-end manufacturing. Unlike previous expansions driven primarily by capacity needs, this initiative reflects a proactive response to future industry trends.

General Manager He Zixiu passionately reflected on ASKPCB's journey from its initial exploration of HDI technology to major breakthroughs, commending the team's outstanding performance throughout. He underscored the significance of this groundbreaking as a pivotal moment in ASKPCB's advancement into high-density interconnect, advanced HDI, and computing-driven products. He described it as the first step in the company's upward evolution—from AnyLayer HDI to eventually entering the emerging MSAP substrate arena.

In his speech, Chairman Cheng Yong highlighted that the new plant is not only a strategic move to expand production capacity and meet rising customer demands, but also a response to the high expectations of stakeholders. Building on the experience accumulated at the Zhaoqing base, the facility will serve increasingly complex and high-end markets. It will also incorporate ASKPCB's proprietary technologies and align with ESG principles, striving to become a “factory of the future”—green, intelligent, and sustainable, with zero discharge of wastewater, solid waste, or emissions. Designed for agility, it will support multi-variety, small-batch, and high-difficulty orders with flexible delivery capabilities.

Company leadership and senior management representatives ceremonially broke ground together with shovels

After the ceremony, attendees gathered for a commemorative group photo