As semiconductor and PCB technologies become increasingly intertwined, leading Asian players are accelerating collaboration and innovation to seize emerging opportunities across advanced packaging and smart manufacturing.

AMPOC Far-east Partners with Korea's DCT to Develop Lithography Materials

Taiwan-based PCB equipment supplier AMPOC Far-East Co., Ltd. (TPE: 2493) announced on June 8 that it has signed an agreement with South Korea's DCT Material Co. to establish a joint venture in Taiwan. The new company will focus on the development, production, and sales of advanced lithography materials used in semiconductor manufacturing, along with technical support services.

While formal joint venture details are still being finalized, AMPOC Far-east expects to complete the agreement by the end of 2025. The partnership aims to strengthen both parties' presence in the semiconductor materials market, with a specific focus on supporting advanced semiconductor processes. AMPOC Far-east emphasized that the move is aligned with its strategy to expand in both domestic and global advanced process materials markets and is expected to positively contribute to shareholder value.

Zhen Ding Technology Expands Global PCB Footprint with AI-Driven Smart Factories

Meanwhile, Zhen Ding Technology Group (TPE: 4958), the world's largest PCB manufacturer by market share, is pursuing rapid transformation through high-end IC substrate technologies and smart manufacturing. During the “2025 Two Thousand Forum” hosted by CommonWealth Magazine, General Manager Chen-Fu Chien emphasized that Zhen Ding is strategically aligning with semiconductor trends through vertical integration, advanced circuit design, and AI adoption.

With AI-related products already accounting for over 70% of its offerings, Zhen Ding is fully implementing Industry 4.0 smart factories at new sites and upgrading existing facilities to Industry 3.5 standards. The company operates 29 manufacturing bases globally, serving as a key enabler of global supply chain resilience. Its smart factories integrate digital platforms, intelligent equipment management, and real-time data analytics to optimize yield, quality, and delivery.

In terms of investment, Zhen Ding recorded FY24 revenue of TWD 171.7 billion, with R&D spending reaching TWD 11.7 billion, nearly 7% of revenue. Backed by over TWD 80 billion in cash, the company plans to sustain long-term innovation and maintain its leadership in both PCB and semiconductor-adjacent technologies.

Conclusion: PCB and Semiconductor Industries Enter New Era of Convergence

As Asia's PCB companies extend into materials, advanced manufacturing, and semiconductor technologies, the lines between the two industries are increasingly blurring. Whether through joint ventures in advanced lithography materials or the deployment of smart factories supporting chip miniaturization and integration, companies like AMPOC Far-east and Zhen Ding exemplify a broader industry trend—one where PCB players are emerging as critical enablers in the global semiconductor value chain.