Samsung Electro-Mechanics (KRX: 009150) has entered early discussions with Apple over the potential supply of glass substrates for semiconductor packaging, according to industry sources on June 4, 2025. While the talks are still in preliminary stages, Apple's interest in large-area glass substrate solutions has drawn significant attention across the chip packaging industry.

The move aligns with Apple's ongoing efforts to expand its artificial intelligence semiconductor capabilities. The company is working with Broadcom to develop custom AI server chips (ASICs), aiming to begin shipments in 2026. As Apple evaluates advanced packaging technologies for these chips, glass substrates are being considered for their superior thermal, electrical, and integration performance.

Samsung Electro-Mechanics is actively investing in glass substrates as a next-generation solution for high-performance semiconductor applications. The company plans to begin prototype production as early as July 2025 at its Sejong plant in South Korea, with mass production targeted for 2027. Sample shipments to two to three major U.S.-based tech companies are expected before the end of this year.

“With the surge in AI computing demand, semiconductor packaging must become smaller, faster, and more heat-resistant,” said one industry official. “Glass substrates can meet all these advanced requirements and are widely seen as a key next-generation technology.”